Semiconductor Equipment Corp 860 Flip Chip Die Bonder For Sale

Semiconductor Equipment Corp 860 Flip Chip Die Bonder


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Semiconductor Equipment Corp 860 Flip Chip Die Bonder:
$7,500

Semiconductor Equipment Corp 860 Flip Chip Die Bonder
Bonder is in used condition and is being sold AS IS, not tested.

The photos provided are of the actual item. Please read description and look closely at photos. All sales are final, and all products are sold without warranties or guarantee, and no returns are accepted. You will receive only what it shown in the photos. If you are unsure if this item will work for you, please refrain from offerding on the item. We strive for happy customers and go out of our way to provide an accurate representation of what we are selling.

Payment: We accept PayPal only and payment is to be made within 3 days of sale end.

Sales tax: We must collect sales tax for NY and Indiana. NY State residents are required to pay sales tax based on their county of residence. Please wait for your invoice prior to payment so we may invoice the sales tax accordingly. If you choose to pay prior to receiving your invoice you will be charged the sales tax rate of 8.875%.

Shipping: Shipping iswithin the US only. Buyer to arrange freight shipment. Shipping and handling costs are the responsibility of the buyer. Bonder will be packed on a skid. Handling cost is $100. Items are typically ready for pick up 5 days after payment is made. Please contact us for weight and dimension information. Local pick up is an option. We do not accept offers from freight forwarders or other 3rd parties which represent international buyers or international on-line sales.

Please ask any questions before offerding. Thank you!

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