5 Thermal Heat Conductive Pads T-Flex 6100, Heatsink Cooling Fan CPU Peltier For Sale

5 Thermal Heat Conductive Pads T-Flex 6100, Heatsink Cooling Fan CPU Peltier
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5 Thermal Heat Conductive Pads T-Flex 6100, Heatsink Cooling Fan CPU Peltier:
$0.99

2108B3F.12

New Thermagon (by Laird Technologies), 47mm x 66mm x 2.75mm, 600 Series, T-Flex 6100, Thermal Conductive / Electrical Insulating Gap Filler Pads, Supplier Part Number A12624-22, Customer Part Number 230-2008-01 Rev 50. Each offer quantity is for a Lot of Five (5) Pads. You may offer / buy any number of lots, up to the total quantity available above.

These were purchased from an electronics liquidator earlier this year, and they were received brand new and clean in the original factory boxes. We repackaged them in 4-mil Ziplok bags for resale. Best we can determine, these are some kind of Boron Nitride material bound in a very soft silicone elastomer. The result is an amazing material which is not only an effective and pliable electrical insulator, but which also absorbs and diffuses heat like a heatsink.

The manufacturer describes the firmness as 25 Shore OO. Near as we can research, the Shore OO scale is used to rate the hardness of foam rubbers and other soft materials. In layman\'s terms, it is relatively heavy and very soft to the touch, but not exactly rubbery. It stays intact and holds its shape when handled and bent slightly, yet it can be easily cut or torn. It is somewhat tacky when you first peel off the protective plastic, and the more you handle it the tackier it seems to get. If you knead a piece with your fingers, it molds together almost like a stiff putty -- maybe a little stiffer and less sticky than biscuit dough. There is little to no odor, and the only handling precaution on the datasheet is not to get it in your eyes. Notwithstanding, I still wouldn\'t suggest feeding it to the kids. It feels cold and clammy to the touch due to its extreme heat absorption properties. Having said all that, it should be perfect for dissipating heat from densely populated circuit board components.


According to the calipers

Overall length: 2.600\" / 66mm

Overall width: 1.850\" / 47mm

Thickness: .118\" / 2.75mm


According to the manufacturer:

Item # Tflex 6100, Tflex™ 600 Series Gap Filler Material

Tflex 600 Series™ is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3.0 W/m-K. These outstanding properties are the result of a proprietary boron nitride filler in the composition.

The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. While extremely soft, Tflex 600 recovers to over 90% of its original thickness after compression under low pressure.

Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is electrically insulating, stable from -45ºC to 200ºC and meets UL 94HB rating.

Properties

Construction and Composition: Boron nitride filled, silicone elastomer

Color: Blue-Violet

Thickness: 0.100 inches / 2.540 mm

Thickness Tolerance: ±0.010 inches / ±0.250 mm

Density: 1.34 g/cc

Hardness: 25 Shore OO

Test Method - Hardness: ASTM D2240

Tensile Strength: 15 psi

Test Method - Tensile Strength: ASTM D412

Elongation: 75.0 %

Test Method - Elongation: ASTM D412

UL Flammability Rating: UL 94 V0

Shelf Life: Indefinite

Temperature Range: -45 to 200 ºC

Thermal Conductivity: 3.00 W/m-K

Test Method - Thermal Conductivity: ASTM D5470 (modified)

Thermal Impedance at 10 psi: 1.23 ºC-in2/W

Thermal Impedance at 69 KPa: 7.94 ºC-cm2/W

Test Method - Thermal Impedance: ASTM D5470 (modified)

Coefficient of Thermal Expansion: 430 ppm/ºC

Test Method - Coefficient of Thermal Expansion: IPC-TM-650 2.4.24

Breakdown Voltage: >5000 VAC

Test Method - Breakdown Voltage: ASTM D149

Volume Resistivity: 2 x 1013 ohm-cm

Test Method - Volume Resistivity: ASTM D257

Dielectric Constant at 1 MHz: 3.31

Test Method - Dielectric Constant: ASTM D150

Dissipation Factor at 1 MHz: >0.001

Test Method - Dissipation Factor : ASTM D150

Features and Benefits

Very high compressibility for low stress applications

3.0 W/m-K thermal conductivity

Thickness: 3mm

Naturally tacky, often needs no further adhesive coating

Applications

Cooling multiple components to the chassis or frame

High speed mass storage drives

RDRAM memory modules

Heat pipe thermal solutions

Automotive engine control units

Telecommunications hardware

Optic fiber transmission hardware

inkFrog Analytics



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