Semiconductor Dicing Saw Blades ADT Nickel Hub Blades. 1 ea. ADT part number 00757-7330-760-200. These are 1-3um grit size, medium concentration, 25um-30um thick, 760um exposure medium bond hardness. Excellent all around blade for Silicon and various other materials. Disco, ThermoCarbon, ITI, St Gobain
D/I I/F BOARD EAUA 536100 DDC-2V 12VIN DISCO DICING SAW SEMICONDUCTOR SYTEM USED
$52.50
SEMICONDUCTOR WAFER SILICON WITH COMPONENTS DICED ON MASK AS IS BIN#P6-84
$64.99
TDK NOISE FILTER ZAG2220-11P 250V 20A SEMICONDUCTOR PARTS EQUIPMENT DICING SAW 1
$10.50