Stencils Kit BGA template Pressure Welding Stencils For MTK Samsung HTC Huawei For Sale
Stencils Kit BGA template Pressure Welding Stencils For MTK Samsung HTC Huawei:
Product DescriptionStencils Kit BGA template Pressure Welding Stencils For MTK Samsung HTC Huawei Product description: 100% brand new and high quality Made of high-quality materials, durable These 3 BGA template tin plates are used for Samsung Android Android MTK series chip IC plant tin repair Package Contents: 1 *BGA pressure welding steel plate for S5026 48 in 1 Samsung 1 *BGA pressure welding mold for A418 Samsung HTC HUAWEI android MTK 1 *BGA pressure welding template for A90 MTK series Note: 1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness. 2. Please allow slight manual measurement deviation for the data.Payment We accept payment via Paypal only. Payment must be completed within 5 days. If you have any problems about payment, please contact us via message.Delivery details We only ship to confirmed Paypal addresses. Please comfirm that your paypal address is in line with your shipping address. Please kindly note that the combined shipping is not provided because the shipping fee is calculated by weight. Also, the each additional item means exactly the the same color and size. It takes about 7-15 working days to US; about 10-30 working days to other countries. Transit time may be a little delayed because of the bad weather and customs inspection. If you do not receive your item within 30 working days since payment finished, please contact us immediately for further assistance. Contact us We strive for 100% customer satisfaction! Positive response is very important to us. If you have any questions, please feel free to contact us via "Ask seller a question" . We will reply your email within 24 working hours.